I have no science behind my conclusion/opinion. IMO, I never liked the SCTY business model...no charge product/leasing/becoming in essence, a utility company. I believe their business model would need to be changed or would fail. I know many feel they were a quarter or two away from turning a profit. Personally, I think they were a year away from potential failure. During the next 3-6 months I saw their value dropping dramatically. TM is overpaying (some would call it bailing out) for SCTY.
Now, TM is at a critical stage. They are trying to bridge the gap between bringing the supply/demand up for the S and X to help pay for the
model 3. So, what do they do....let us not only try to fund that but lets overpay for SCTY. I have said before that these decisions/timing are far above my pay grade but personally.....I think this is a *stupid* move.
I have been wrong before and this may turn out to be a brilliant move. I think it would be a good move...in late 2017. They could buy the Buffalo manufacturing facility for next to nothing and add it to TE.
The reason I think that product cycle is indeed had a major contribution to the decision is that new battery pack architecture introduced to the TA is going to have a major impact on TE - I am thinking that the extra space freed in the (Powerwall/Powerpack) "pod" due to new pack architecture can be used for integral bidirectional inverter. Once again, not trying to convince you, just presenting information which you might not considered. Whether you buy this line of thinking or not is totally beyond the point. The point I am trying to make is that Musk and JB did have a specific basis for saying that timing of merger is tied to product cycle, notwithstanding everybody ignoring this fact. Again, whether your considerations outweigh this product cycle considerations or not is subject of entirely different discussion, but that discussion could not even be had, unless there is a recognition that Musk and JB mentioning product cycle was something real especially given the introduction of new pack architecture for P100D.
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