BioSehnsucht
Model 3 LR
If it was a regular semiconductor package, I would consider that it might even be cheaper with the newer tech, as even with more transistors, if the process is mature enough, compared to an older one, sometimes the package area is smaller enough that you fit so many more dies per wafer that the total cost comes down.So presumably this increases parts cost for the camera modules? Offsetting what's saved by eliminating the USS?
However, I imagine a camera device will have some minimum viable size so I don't imagine the same logic applies to them. They might end up roughly equivalent if the process node they're built on isn't particularly more expensive (it seems likely that the old cameras used an older node, if only because they likely existed for some time and that was what was current when they were designed). If they're on the same/similar node and the dies ended up larger, then they'd definitely cost more (there's some small possibility that they are on the same/similar node, but the die sizes stay roughly the same, but that seems an unlikely combination).