The thicker aluminum nitride or alumina, seems to be a good solution. I believe small amount of high temperature resistant thermally conductive paste has been used in some of the posts above to assist the thermal interface. This may be a good idea as none of the interfaces are perfectly flat at the microscopic level.
I'm not sure a bonded epoxy would be the most ideal either to replace the ceramic or at the interface. There is still some thermal mismatch between the aluminum sink, ceramic, and IGBT/boards. Personally, I would like the interfaces to be able to slip a bit even if a few tens of microns. If they don't something will have to break or be under much stress. That being said,a thermoset epoxy will be much more resistant to creep than the materials which was used by tesla (which seems to be a thermoplastic). Hopefully the ceramic approach by this thread's pioneers eventually demonstrates robustness and we all will have viable solution at hand.
I'm not sure a bonded epoxy would be the most ideal either to replace the ceramic or at the interface. There is still some thermal mismatch between the aluminum sink, ceramic, and IGBT/boards. Personally, I would like the interfaces to be able to slip a bit even if a few tens of microns. If they don't something will have to break or be under much stress. That being said,a thermoset epoxy will be much more resistant to creep than the materials which was used by tesla (which seems to be a thermoplastic). Hopefully the ceramic approach by this thread's pioneers eventually demonstrates robustness and we all will have viable solution at hand.